Deep submicron Standard Cell

  • ASIC Design Services
  • Turnkey Services
Deep submicron Standard Cell

We leverage and incorporate Fujitsu 90nm,65nm, and finer geometry standard cell solutions.

 
Fujitsu 90nm Standard Cell Special Features:

1.Efficiency is 25% faster than that of 90nm technology of other major semiconductor
　 manufacturers.
2. Leakage current is approximated 1/5th of that of general semiconductor manufacturers.

Item Typical semiconductor vendors (90nm) Fujitsu (90nm)
Speed 100 125
Operational power 100 75
Standby power 100 21
Table: Benchmark results for 90nm technology

3. Minimum gate length of 40nm.
4. Low-k, up to 10 layer interconnection technology.
5. Silicon-proven high speed I/O and PHY macros ready for use.

Fujitsu 90nm Standard Cell Special Features:

1. The 30nm long gate.
2. 20 to 30% faster performance than the 90nm generation
3. Transistor density doubled compared with the 90nm generation
4. SRAM cell area reduced 50% compared with the 90nm generation.

IC Nexus is implementing Fujitsu & EDA tool venders’ stringent reference design flows to offer RTL, Netlist, to FPGA Netlist handoff models to ASIC customers.
Design Methodology

We incorporate design methodology which assures maximum probability for first-pass design success. This methodology when incorporated with our disciplined engineering team allows IC Nexus to complete all projects with unrivaled quality.

 
Netlist Handoff Design Flow

Production

IC Nexus has established partnerships with multiple foundries. This provides our customers with a broad range of solutions as well as ensuring quality and capacity.

We provide prototyping services as well as volume production services.

 

Prototyping

As technology geometries become finer and designs become more complex, the related mass production cost, which comprises mostly wafer masks cost, is becoming exponentially higher. In order to cope with this issue and reduce the cost before a chip can be volume-shipped to the market, IC Nexus offers our customers wafer shuttle services (MPW) and additional prototyping diagnostics services from a variety of foundries and test partners at acceptable and reasonable prices. By Partnering with top foundries and test houses, we are competent to satisfy every of your prototyping projects. For deep submicron, such as 90nm and finer geometries, prototyping services, we work with Fujitsu to provide shuttle services about once a month. The shuttle output can be either bare dice or packaged chips depending on customers’ request. For detailed prototyping services technologies and capabilities, such as shuttle offerings and schedule updates, test capabilities in terms of types of testers, please contact our office by email: sales@icnexus.com or call us directly.

 

Volume Production

IC Nexus offers our customers tape-out, GDSII, to wafer production services in conjunction with our wafer foundry partners. We offer two models- unsorted wafer and known-good-die models. If a customer has its in-house product engineering and assembly and test capability, ??unsorted wafer model??/strong> will be the suitable choice. If a customer wants to coordinate assembly and test tasks ??sorted wafer model??/strong> will be more appropriate. The whole production process starts from accepting customers?? GDSII, taping out customers??designs to a chosen foundry, arranging mask-making and finished wafers. Combined with our logistics expertise, we will deliver manufactured wafers to our customers.
Assembly & Test

By partnering with different assembly and test houses, IC Nexus is able to offer our customers a variety assembly and test solutions to meet your specific post-wafer processing demand.

At the moment, we specifically provides SiP/MCM, System in Package/Multi-Chip Module, assembly and test services to fulfill smaller size than individual IC, better electrical performance, lower cost, and time to market requirements.

Assembly
IC Nexus provides ASIC assembly service through the close corporation of major assembly houses throughout Asia. Most of the industrial standard packages are available for choice as needed. Other packages like CSP (Chip Scale Package), Flip BGA, etc., can also be accessed through IC Nexus at competitive development tooling cost and fast cycle time.

Advantages
- broad range of packages available from a single service provider
- competitive development tooling cost and fast cycle time

Test

IC Nexus provides ASIC testing service via close corporation with major testing houses in Taiwan. The testing scope covers a broad range of application fields from logic, mixed-signal, RF, to memory tests. IC Nexus integrates the testing development at competitive tooling cost and fast cycle time.

 

Advantages

- broad range of application fields available from a single service provider

- competitive development tooling cost and fast cycle time

- expert prototyping service

 

Logic Test

Target Devices Any logic ASIC in data communication, PC peripheral, industrial, and consumer fields.
Tester Spec. Max I/Os: 128/256/304/384/448 pins, Max frequency: 10/50/100/200 MHz.

 

Mixed - Signal Test

Target Devices Any mixed-signal or SoC ASIC in video, high-quality audio, speech reconnection applications.
Tester Spec. Max digital I/Os: 256/304/448 pins, Max digital frequency: 100/200 MHz; Max analog I/Os: 64 pins, Max analog measurement: ?0V/150mA, Max analog resolution: 16bits @100K sample/s.

 

RF Test

Target Devices CDMA/GSM: RFPA, LMA, Mixer devices; Bluetooth/HomeRF: RF and IF ASICs; General wireless transceiver ASICs (Available in Q2, 2002)
Tester Spec. One test head and three RF ports, Vector test port: max 3GHz, Scalar test port: max 18GHz.

 

Memory Test

Target Devices SRAM, DRAM, ROM, Flash Memory, and SIMM/DIMM module.
Tester Spec. Max I/Os: 576 pins, Max D/R: 960 pins, Max frequency: 250 MHz.